DA1178.006
13 July, 2006
PIN DESCRIPTION
Pin Description
Power Supply Voltage
Serial Bus Clock Input
Serial Bus Data Input
Programming Input
Voltage Control Input
Crystal Oscillator Output
Crystal/Varactor Oscillator Input
Power Supply Ground
Buffer Output
Symbol
VDD
CLK
DA
PV
VC
X2
X1
VSS
OUT
x-coordinate
182
645
418
876
215
1053
434
617
1218
y-coordinate
1317
1329
1329
1311
213
209
209
2267
1329
Note:
Because the substrate of the die is internally connected to GND, the die has to be connected to GND or
left floating. Please make sure that GND is the first pad to be bonded. Pick-and-place and all component
assembly are recommended to be performed in ESD protected area.
Note:
Pad coordinates are measured from the left bottom corner of the chip to the center of the pads. The
coordinates may vary depending on sawing width and location, however, distances between pads are accurate.
ABSOLUTE MAXIMUM RATINGS
Parameter
Supply Voltage
Input Voltage
Power Dissipation
Operating Temperature
Storage Temperature
Note 1:
Not valid for programming pin PV
Symbol
V
DD
- V
SS
V
IN
P
MAX
T
OP
T
ST
Min
-0.3
V
SS
-0.3
-35
-55
Max
6.0
V
DD
+ 0.3
100
85
150
Unit
V
V
mW
o
C
o
C
Note
1)
RECOMMENDED OPERATION CONDITIONS
Parameter
Supply Voltage
Supply Current
Operable Temperature
Storage Temperature
Symbol
V
DD
I
dd
T
C
T
S
Conditions
Vdd = 2.8 Volt
Relative humidity =
15%…70%
-30
-5
Min
2.7
Typ
2.8
2.3
Max
5.5
+85
+40
Unit
V
mA
o
C
o
C
2 (5)
MAS [ MICRO ANALOG SYSTEMS ]
