DA1178.006
13 July, 2006
ORDERING INFORMATION
Product Code
Product
Package
Comments
Die size 1430 x 1542 µm
Die size 1430 x 1542 µm
MAS1178ATC1
IC FOR VCXO
EWS tested wafers 400 µm
MAS1178ATF1
IC FOR VCXO
EWS tested wafers 254 µm
MAS1178
IC FOR VCXO
SMD Package T.B.D.
Please contact Micro Analog Systems Oy for other wafer thickness options.
LOCAL DISTRIBUTOR
MICRO ANALOG SYSTEMS OY CONTACTS
Micro Analog Systems Oy
Kamreerintie 2, P.O. Box 51
FIN-02771 Espoo, FINLAND
Tel. +358 9 80 521
Fax +358 9 805 3213
http://www.mas-oy.com
NOTICE
Micro Analog Systems Oy reserves the right to make changes to the products contained in this data sheet in order to improve the design or
performance and to supply the best possible products. Micro Analog Systems Oy assumes no responsibility for the use of any circuits
shown in this data sheet, conveys no license under any patent or other rights unless otherwise specified in this data sheet, and makes no
claim that the circuits are free from patent infringement. Applications for any devices shown in this data sheet are for illustration only and
Micro Analog Systems Oy makes no claim or warranty that such applications will be suitable for the use specified without further testing or
modification.
5 (5)
MAS [ MICRO ANALOG SYSTEMS ]
