DA1175.008
13 July, 2006
PIN DESCRIPTION
Pin Description
Power Supply Voltage
Programming Input
Serial Bus Clock Input
Serial Bus Data Input
Temperature Output
Test Multiplexer Output
Voltage Control Input
Crystal Oscillator Output
Crystal/Varactor Oscillator Input
Power Supply Ground
Buffer Output
Symbol
VDD
PV
CLK
DA
TE1
TE2
VC
X1
X2
VSS
OUT
x-coordinate
263
503
745
1001
1246
1454
190
398
1355
1828
2031
y-coordinate
1330
1326
1321
1321
1325
1325
231
231
231
242
231
Note:
Because the substrate of the die is internally connected to VDD, the die has to be connected to VDD or
left floating. Make sure that VDD is the first pad to be bonded. Pick-and-place and all component assembly are
recommended to be performed in ESD protected area.
Note:
Pad coordinates are measured from the left bottom corner of the chip to the center of the pads. The
coordinates may vary depending on sawing width and location, however, distances between pads are accurate.
ABSOLUTE MAXIMUM RATINGS
Parameter
Supply Voltage
Input Voltage
Power Dissipation
Storage Temperature
Note:
Not valid for programming pin PV
Symbol
V
DD
- V
SS
V
IN
P
MAX
T
ST
Min
-0.3
V
SS
-0.3
-55
Max
6.0
V
DD
+ 0.3
20
150
Unit
V
V
mW
o
C
Note
1)
RECOMMENDED OPERATION CONDITIONS
Parameter
Supply Voltage
Supply Current
Operable Temperature
Storage Temperature
Crystal Pulling Sensitivity
Load Capacitance
Symbol
V
DD
I
CC
T
C
T
S
S
C
L
Conditions
Vcc = 2.8 Volt
Relative humidity =
15%…70%
-30
-5
30
10
Min
2.7
Typ
2.8
Max
5.5
1.8
+85
+40
Unit
V
mA
o
C
o
C
ppm/pF
pF
2 (9)
MAS [ MICRO ANALOG SYSTEMS ]
