TL(RE,RME,SE,OE,YE,PYE,GE,FGE,PGE)50T(F)
Maximum Ratings (Ta = 25°C)
Operating
Temperature
Storage
Temperature
Forward Current
Product Name
Reverse Voltage
(V)
Power Dissipation
(mW)
I
(mA)
V
P
D
F
R
T
opr
(°C)
T
stg
(°C)
TLRE50T(F)
TLRME50T(F)
TLSE50T(F)
TLOE50T(F)
TLYE50T(F)
TLPYE50T(F)
TLGE50T(F)
TLFGE50T(F)
TLPGE50T(F)
50
50
50
50
50
50
50
50
50
4
120
120
120
120
120
120
120
120
120
4
4
4
4
4
4
4
4
−40~100
−40~120
Electrical and Optical Characteristics
=
(Ta 25°C)
Luminous Intensity
Forward Voltage
Reverse Current
Typ. Emission Wavelength
Product Name
I
V
I
R
V
F
Min
850
Typ.
I
Typ.
1.9
Max
I
Max
50
V
R
λ
λ
∆λ
I
F
F
F
d
P
TLRE50T(F)
TLRME50T(F)
TLSE50T(F)
TLOE50T(F)
TLYE50T(F)
TLPYE50T(F)
TLGE50T(F)
TLFGE50T(F)
TLPGE50T(F)
Unit
630
626
613
605
587
580
571
565
558
(644)
(636)
(623)
(612)
(590)
(583)
(574)
(568)
(562)
nm
20
20
20
20
20
20
20
20
20
20
mA
1800
20
20
20
20
20
20
20
20
20
mA
2.4
20
20
20
20
20
20
20
20
20
mA
4
23
20
20
17
14
17
15
14
850
1530
1530
1530
850
2200
3500
4500
3500
2500
1500
1000
600
1.9
1.9
2.0
2.0
2.0
2.0
2.0
2.1
2.4
2.4
2.4
2.4
2.4
2.4
2.4
2.4
50
50
50
50
50
50
50
50
µA
4
4
4
4
4
4
4
4
V
476
272
153
mcd
V
Precautions
Please be careful of the following:
•
•
•
Soldering temperature: 260°C max, soldering time: 3 s max
(soldering portion of lead: up to 2 mm from the body of the device)
If the lead is formed, the lead should be formed up to 5 mm from the body of the device without forming stress to
the resin. Soldering should be performed after lead forming.
This visible LED lamp also emits some IR light.
If a photodetector is located near the LED lamp, please ensure that it will not be affected by this IR light.
2
2005-09-13
MARKTECH [ MARKTECH CORPORATE ]
