TE Connectivity
Single-channel Silicon ESD Protection Devices
RECOMMENDED SOLDER PAD LAYOUT
Single-channel SESD 0402 XDFN Pad Layout
A
A
F
F
Single-channel SESD 0201 XDFN Pad Layout
A
A
F
F
B
B
B
B
D
D
D
D
SESD Landing Pad Layout
0402 Package
Symbol
A
B
D
F
Millimeters
0.60
1.00
0.35
0.30
Inches
0.024
0.039
0.014
0.012
Symbol
A
B
D
F
SESD Landing Pad Layout
0201 Package
Millimeters
0.32
0.62
0.24
0.14
Inches
0.013
0.024
0.009
0.006
MATERIAL INFORMATION
RoHS Compliant
ELV Compliant
Halogen Free*
Pb-Free
Directive 2000/53/EC
Compliant
Directive 2002/95/EC
Compliant
HF
Pb
* Halogen Free refers to: Br≤900ppm, Cl≤900ppm, Br+Cl≤1500ppm.
SESD devices meet MSL-1 Requirements
DFN case epoxy meets UL 94 V-0
te.com
MACOM [ Tyco Electronics ]
