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RXEF110-2 参数 Datasheet PDF下载

RXEF110-2图片预览
型号: RXEF110-2
PDF下载: 下载PDF文件 查看货源
内容描述: PolySwitch自复式元件 [PolySwitch Resettable Devices]
分类和应用:
文件页数/大小: 27 页 / 408 K
品牌: MACOM [ Tyco Electronics ]
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Table R5 - Physical Characteristics and Environmental Specifications for Radial-leaded Devices  
... Cont'd  
RTEF  
Physical Characteristics  
Lead material  
Tin-plated copper-clad steel, 0.205mm2 (24AWG), ø0.40mm (0.016in.)  
Solderability pre ANSI/J-STD-002 Category 3  
per IEC-STD 68-2-20, Test Tb, Method 1a, condition b; can withstand 10 seconds at 260°C ±5°C  
Cured, flame-retardant epoxy polymer; meets UL 94V-0  
Soldering characteristics  
Solder heat withstand  
Insulting material  
RTEF  
Environmental Specifications  
Test  
Conditions  
Resistance Change  
Passive aging  
70°C, 1000 hours  
±5%  
85°C, 1000 hours  
±5%  
Humidity aging  
Thermal Shock  
Solvent resistance  
85°C, 85%RH, 1000 hours  
85°C, -40°C (10 times)  
MIL-STD-202, Method 215F  
±5%  
±5%  
No change  
RUEF  
Physical Characteristics  
Lead material  
RUEF090 to RUEF250: Tin-plated copper-clad steel, 0.205mm2 (24AWG)  
RUEF300 to RUEF900: Tin-plated copper, 0.52mm2 (20AWG), ø0.81mm (0.032in.)  
Soldering characteristics  
Solder heat withstand  
Insulting material  
Solderability pre ANSI/J-STD-002 Category 3  
per IEC-STD 68-2-20, Test Tb, Method1a, condition b, can withstand 10 seconds at 260°C ±5°C  
Cured, flame-retardant epoxy polymer; meets UL 94V-0  
Devices are not designed to be placed through a reflow process.  
RUEF  
Environmental Specifications  
Test  
Conditions  
Resistance Change  
Passive aging  
70°C, 1000 hours  
±5%  
85°C, 1000 hours  
±5%  
Humidity aging  
Thermal Shock  
Solvent resistance  
85°C, 85%RH, 1000 hours  
85°C, -40°C (10times)  
MIL-STD-202, Method 215F  
±5%  
±5%  
No change  
RUSBF  
Physical Characteristics  
Lead material  
RUSBF075: Tin-plated nickel-copper alloy, 0.205mm2 (24AWG), ø0.51mm/0.020in.  
RUSBF090 to RUSBF250: Tin-plated copper clad-steel, 0.205mm2 (24AWG), ø0.51mm/0.020in.  
Solderability pre ANSI/J-STD-002 Category 3 except  
Soldering characteristics  
Solder heat withstand  
Insulting material  
RUSBF075 meet ANSI/J-STD-002 Category 1  
RUSBF120: per IEC-STD 68-2-20, Test Tb, Method 1a, condition a; can withstand 5 seconds at 260°C ±5°C  
All others: per IEC-STD 68-2-20, Test Tb, Method 1a, condition b; can withstand 10 seconds at 260°C ±5°C  
Cured, flame-retardant epoxy polymer; meets UL 94V-0  
Devices are not designed to be placed through a reflow process.  
RUSBF  
Environmental Specifications  
Test  
Conditions  
Resistance Change  
Passive aging  
70°C, 1000 hours  
±5%  
85°C, 1000 hours  
±5%  
Humidity aging  
Thermal Shock  
Solvent resistance  
85°C, 85%RH, 1000 hours  
85°C, -40°C (10 times)  
MIL-STD-202, Method 215F  
±5%  
±5%  
No change  
RGEF  
Physical Characteristics  
13  
Lead material  
RGEF300 to RGEF1100: Tin-plated copper, 0.52mm2 (20AWG), ø0.81mm/0.032in.  
RGEF1200 to RGEF1400: Tin-plated copper, 0.82mm2 (18AWG), ø1.0mm/0.04in.  
Solderability pre ANSI/J-STD-002 Category 3  
RGEF300K and RGEF400: per IEC 68-2-20, Test Tb, Method 1a, condition a; can withstand 5 seconds at 260°C ±5°C  
RGEF500 to RGEF1400: per IEC 68-2-20, Test Tb, Method 1a, condition b; can withstand 10 seconds at 260°C ±5°C  
Cured, flame-retardant epoxy polymer; meets UL 94V-0  
Soldering characteristics  
Solder heat withstand  
Insulting material  
Devices are not designed to be placed through a reflow process.  
126  
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