PolySwitch Resettable Devices
Table R5 - Physical Characteristics and Environmental Specifications for Radial-leaded Devices
RTEF
Physical Characteristics
Lead material
Soldering characteristics
Solder heat withstand
Insulting material
RTEF
Environmental Specifications
Test
Passive aging
Humidity aging
Thermal Shock
Solvent resistance
RUEF
Physical Characteristics
Lead material
Soldering characteristics
Solder heat withstand
Insulting material
RUEF
Environmental Specifications
Test
Passive aging
Humidity aging
Thermal Shock
Solvent resistance
RUSBF
Physical Characteristics
Lead material
Soldering characteristics
Solder heat withstand
Insulting material
RUSBF
Environmental Specifications
Test
Passive aging
Humidity aging
Thermal Shock
Solvent resistance
RGEF
Physical Characteristics
Lead material
Soldering characteristics
Solder heat withstand
Insulting material
Conditions
70°C, 1000 hours
85°C, 1000 hours
85°C, 85%RH, 1000 hours
85°C, -40°C (10 times)
MIL-STD-202, Method 215F
Resistance Change
±5%
±5%
±5%
±5%
No change
RUSBF075: Tin-plated nickel-copper alloy, 0.205mm
2
(24AWG), ø0.51mm/0.020in.
RUSBF090 to RUSBF250: Tin-plated copper clad-steel, 0.205mm
2
(24AWG), ø0.51mm/0.020in.
Solderability pre ANSI/J-STD-002 Category 3 except
RUSBF075 meet ANSI/J-STD-002 Category 1
RUSBF120: per IEC-STD 68-2-20, Test Tb, Method 1a, condition a; can withstand 5 seconds at 260°C
±5°C
All others: per IEC-STD 68-2-20, Test Tb, Method 1a, condition b; can withstand 10 seconds at 260°C
±5°C
Cured, flame-retardant epoxy polymer; meets UL 94V-0
Conditions
70°C, 1000 hours
85°C, 1000 hours
85°C, 85%RH, 1000 hours
85°C, -40°C (10times)
MIL-STD-202, Method 215F
Resistance Change
±5%
±5%
±5%
±5%
No change
RUEF090 to RUEF250: Tin-plated copper-clad steel, 0.205mm
2
(24AWG)
RUEF300 to RUEF900: Tin-plated copper, 0.52mm
2
(20AWG), ø0.81mm (0.032in.)
Solderability pre ANSI/J-STD-002 Category 3
per IEC-STD 68-2-20, Test Tb, Method1a, condition b, can withstand 10 seconds at 260°C
±5°C
Cured, flame-retardant epoxy polymer; meets UL 94V-0
Conditions
70°C, 1000 hours
85°C, 1000 hours
85°C, 85%RH, 1000 hours
85°C, -40°C (10 times)
MIL-STD-202, Method 215F
Resistance Change
±5%
±5%
±5%
±5%
No change
Tin-plated copper-clad steel, 0.205mm
2
(24AWG), ø0.40mm (0.016in.)
Solderability pre ANSI/J-STD-002 Category 3
per IEC-STD 68-2-20, Test Tb, Method 1a, condition b; can withstand 10 seconds at 260°C
±5°C
Cured, flame-retardant epoxy polymer; meets UL 94V-0
...
Cont'd
Devices are not designed to be placed through a reflow process.
Radial-leaded Devices
Devices are not designed to be placed through a reflow process.
RGEF300 to RGEF1100: Tin-plated copper, 0.52mm
2
(20AWG), ø0.81mm/0.032in.
RGEF1200 to RGEF1400: Tin-plated copper, 0.82mm
2
(18AWG), ø1.0mm/0.04in.
Solderability pre ANSI/J-STD-002 Category 3
RGEF300K and RGEF400: per IEC 68-2-20, Test Tb, Method 1a, condition a; can withstand 5 seconds at 260°C
±5°C
RGEF500 to RGEF1400: per IEC 68-2-20, Test Tb, Method 1a, condition b; can withstand 10 seconds at 260°C
±5°C
Cured, flame-retardant epoxy polymer; meets UL 94V-0
13
Devices are not designed to be placed through a reflow process.
126
MACOM [ Tyco Electronics ]
