Table F4 Packaging Information for All Fuses
Reel Quantity
Carrier
Tape Size
Reels per Outside
Shipment Box
Outside Shipment
Boxes per Overpack
Size
(pcs)
10,000
4,000
6,000
3,000
2,000
Reel Diameter
178mm white plastic
178mm white plastic
178mm white plastic
178mm white plastic
178mm white plastic
Reel Width
9.0 0.5mm
9.0 0.5mm
9.0 0.5mm
9.0 0.5mm
13.4 0.5mm
TapeType
Paper
0402(1005)
0603(1608)
0603SFV(1608)
1206(3216)
2410(6125)
8.00 0.10mm
8.00 0.10mm
8.00 0.10mm
8.00 0.10mm
12.00 0.10mm
5
5
5
5
4
1 to 10
1 to 10
1 to 10
1 to 10
1 to 10
Paper
Paper
Plastic
Plastic
Figure F2 Recommended Soldering Temperature Profile for All Fuses
tp
Critical Zone
TL toTp
Tp
TL
Ramp up
tL
TsMAX
TsMIN
ts
Ramp down
Preheat
25
t 25˚C to Peak
Time
Reflow Profile
Classification Reflow Profiles
Profile Feature
1206/0603/0402
2410
Average ramp up rate (TsMAX toTp)
Preheat
3°C/second max.
3°C/second max.
• Temperature min. (TsMIN
• Temperature max. (TsMAX
• Time (tsMIN to tsMAX
)
150°C
150°C
)
200°C
200°C
11
)
60-180 seconds
40-100 seconds
Time maintained above:
• Temperature (TL)
• Time (tL)
217°C
200°C
60-150 seconds
260°C max.
30-90 seconds
250°C max.
Peak/Classification temperature (Tp)
Time within 5°C of actual peak temperature
Time (tp)
20-40 seconds
8 minutes max.
4°C/second max.
30-40 seconds
40-100 seconds
Natural cooling
From 25°C to preheating (150°C)
Ramp down rate
Recommended conditions for hand soldering:
1. Using hot air rework station that can reflow the solder on both terminations at the same time is strongly recommended,
do not directly contact the chip termination with the tip of soldering iron.
2. Preheating: 150°C, 60s (min).
Appropriate temperature (max) of soldering iron tip/soldering time (max): 280°C /10s or 350°C / 3s.
98
RoHS Compliant, ELV Compliant
HF Halogen Free
MACOM [ Tyco Electronics ]
