Table FH1 Clear Time Characteristics for High-Current-Rated Chip Fuses
1206SFH Series
% of rated current
100%
Clear time at 25°C
4 hours (min.)
250%
5 seconds (max.)
Typical Electrical Characteristics, D
im
ensions and
Recommended Pad Layout for
High-Current-Rated Chip Fuses
Table FH2
1206 (3216mm) High-Current-Rated Chip Fuse
s
Characteristics
Max.
Interrupt Ratings
Shape and
Dimensions
Inch (mm)
0.063 0.008
(1.60 0.20)
0.126 0.008
(3.20 0.20)
Rated
Current
Nominal
Cold DCR
(Ω)*
Nominal
I2t
Voltage
Current
(A)
(A2sec)†
(VDC
)
10
12
15
20
0.010
0.008
0.005
0.003
9
24
100
100
100
100
(0.97 0.20)
14
26
56
24
24
24
0.020 0.010
(0.51 0.25)
*
Measured at Յ10% of rated current and 25°C ambient temperature. †
Melting I2t at 0.001 sec clear time. Recommended
Pad Layout
Inch (mm)
0.173
(4.40)
0.059
(1.50)
0.071
(1.80)
0.057
(1.45)
Figure FH1-FH2 Family P
e
rf
ormance Curves for High-Current-Rated Chip Fuses
Figure FH1
Figure FH2
1206SFH AverageTime Current Curves
1206SFH I²t vs. t Curves
11
10
10000
20A
15A
12A
10A
1
1000
100
10
0.1
0.01
0.001
10
1
100
1000
0.001
0.01
0.1
1
10
Current (A)
Time (s)
Note: Curves are nominal
ꢀ Please go to page 97 for more information for High-Current-Rated Chip Fuses.
88
RoHS Compliant, ELV Compliant
HF Halogen Free
MACOM [ Tyco Electronics ]
