General Purpose Relays
SCHRACK
Miniature Power PCB RY II & RY II reflow-solderable (Continued)
Insulation
CO contact
NO contact
PCB layout / terminal assignment
Dielectric strength coil-contact circuit
open contact circuit
5000 Veff
1000 Veff
Bottom view on solder pins
Clearance / creepage coil-contact circuit
Material group of insulation parts
Tracking index of relay base
Insulation to IEC 60664-1
Type of insulation coil-contact circuit
open contact circuit
W 8 / 8 mm
IIIa
PTI250, PTI 175*
1 CO contact, 3.2 mm
reinforced
functional
Rated insulation voltage
Pollution degree
Rated voltage system
Overvoltage category
250 V
250 V
3
2
3
230 / 400 V
III
230 V
400 V
III
S0254-AA
Other data
RoHS - Directive 2002/95/EC
Flammability class according to UL94
GWFI to IEC 60335-1
compliant as per product date code 0403
V-0
> 850 °C**
> 750 °C**
-40...+70°C
85°C at 6A
typ. 7 / 3 ms
typ. 2.5 / 4.5 ms
20 / 5 g
GWT to IEC 60335-1
Ambient temperature range
Ambient temperature max.
Operate- / release time
S0254-AB
Bounce time NO / NC contact
Vibration resistance (function) NO / NC contact
Shock resistance (function) NO / NC contact
Shock resistance (destruction)
Category of protection
Mounting
Mounting position
Minimum mounting distance
Soldering heat resistance flux proof version
wash tight version
Relay weight
Packaging unit
1 NO, 1 NC contact 5 mm
20 / 5 g
100 g
RTII-flux proof, RTIII- wash tight**
pcb
any
W 0 mm
270°C / 10 s
260°C / 5 s
8 g
20 / 500 pcs
S0254-AC
Accessoires
For technical details see datasheet
Accessoires RYII
*
reflow-solderable version
** not as reflow-solderable version
Pinning 3.2 mm
Dimensions
S0254-AE
S0274-CA
S0254-AD
Pinning 5 mm
S0254-AF
S0274-CB
2
Datasheet
Rev. HC1
Dimensions are in mm unless
otherwise specified and are
shown for reference purposes
only.
Product specification
processing information
‘Schrack’ section.
Issued 2008/03
according to IEC 61810-1.
only to be used together
with the 'Definitions' at
schrackrelays.com in the
www.tycoelectronics.com
www.schrackrelays.com
Product data, technical para-
meters, test conditions and
Specifications subject to
change.
TE [ TE CONNECTIVITY ]
