®
LY61L256
Rev. 1.2
32K X 8 BIT HIGH SPEED CMOS SRAM
PACKAGE OUTLINE DIMENSION
28-pin 300 mil SOJ Package Outline Dimension
28
15
1
14
A2
C
L
X
XX
UNIT
SYM.
INCH(REF)
MM(BASE)
A
0.140 (MAX)
3.556 (MAX)
A1
0.026 (MIN)
0.660 (MIN)
A2
0.100
±
0.005
2.540
±
0.127
B
0.018
±
0.003
0.457
±
0.076
B1
0.028
±
0.003 0.711
±
0.076
c
0.010
±
0.003
0.254
±
0.076
D
0.710
±
0.010
18.03
±
0.254
E
0.337
±
0.010
8.560
±
0.254
E1
0.300
±
0.005
7.620
±
0.127
e
0.050
±
0.003
1.270
±
0.076
L
0.087
±
0.010
2.210
±
0.254
S
0.030
±
0.004
0.762
±
0.102
Y
0.003 (MAX)
0.076 (MAX)
Note : 1.S/E/D dimension is not including mold flash.
2.The end flash in package lengthwise is not more than 10 mils each side.
Lyontek Inc.
reserves the rights to change the specifications and products without notice.
5F, No. 2, Industry E. Rd. IX, Science-Based Industrial Park, Hsinchu 300, Taiwan.
TEL: 886-3-6668838
FAX: 886-3-6668836
8
LYONTEK [ Lyontek Inc. ]
