Reflow Soldering Characteristics
JEDEC 020c
Table 7.
Profile Feature
Average RampꢀUp Rate (Tsmax to Tp)
Preheat Temperature Min (Tsmin
Preheat Temperature Max (Tsmax
Preheat Time (tsmin to tsmax
Lead Free Assembly
3°C / second max
150°C
)
)
200°C
)
60 ꢀ 180 seconds
217°C
Time Maintained Above Temperature (TL)
Time Maintained Above Time (tL)
60 ꢀ 150 seconds
260°C
Peak / Classification Temperature (TP)
Time Within 5°C of Actual Peak Temperature (tP)
20 ꢀ 40 seconds
Ramp ꢀ Down Rate
6°C / second max
8 minutes max
Time 25°C to Peak Temperature
Notes for Table 7:
1. All temperatures refer to the application Printed Circuit Board (PCB), measured on the surface adjacent to the
package body.
9
LUXEON Rebel Datasheet DS56 (7/07)
LUMILEDS [ LUMILEDS LIGHTING COMPANY ]
