Reflow Soldering Guidelines
tp
Tp
Critical ꢂone
L to Tp
Ramp-up
T
TL
tL
Tsmax
Tsmin
Ramp-down
ts
Preheat ꢃrea
25
Time 25ꢀC to Peaꢁ
JEDEC J-STD-020D
Time
Figure 8. Visualization of the acceptable reflow temperature profile as specified in Table 8.
Table 8. Reflow profile characteristics for LUXEON MultiColor Module 0.5W.
PROFILE FEATURE
Preheat Minimum Temperature (Tsmin
Preheat Maximum Temperature (Tsmax
LEAD-FREE ASSEMBLY
)
150°C
200°C
)
Preheat Time (tsmin to tsmax
)
60 to 120 seconds
4°C / second maximum
217°C
Ramp-Up Rate (TL to Tp)
Liquidous Temperature (TL)
Time Maintained Above Temperature TL (tL)
Peak / Classification Temperature (Tp)
Time Within 5°C of Actual Peak Temperature (tp)
Ramp-Down Rate (Tp to TL)
60 to 150 seconds
250°C
20 to 40 seconds
6°C / second maximum
8 minutes maximum
Time 25°C to Peak Temperature
JEDEC Moisture Sensitivity
Table 9ꢀ Moisture sensitivity levels for LUXEON MultiColor Module 0ꢀ5Wꢀ
FLOOR LIFE
SOAK REQUIREMENTS STANDARD
LEVEL
TIME
CONDITIONS
≤30°C / 60% RH
TIME
CONDITIONS
5a
24 hours
48 Hours +2 / -0
30°C / 60% RH
Waterproof Test
Table 10ꢀ Waterproof test for LUXEON MultiColor Module 0ꢀ5Wꢀ[1]
STANDARD
CONDITIONS
IPX8 immersing in 1m water
TIME
24 hours
IEC 60529:2001
Notes for Table 10:
1. Waterproof test is conducted on the component level by assembling the module on a PCB, isolating the electrical path by silicone. It is recommended to test the product in the application and
insulate for moisture.
DS242 LUXEON Multicolor Module 0.5W Product Datasheet 20190802 ©2019 Lumileds Holding B.V. All rights reserved.
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