Reflow Soldering Guidelines
tp
Tp
Critical Zone
L to Tp
Ramp-up
T
TL
tL
Tsmax
Tsmin
Ramp-down
ts
Preheat Area
25
Time 25ºC to Peak
JEDEC J-STD-020D
Time
Figure 10. Visualization of the acceptable reflow temperature profile as specified in Table 8.
Table 8. Reflow profile characteristics for LUXEON IR Domed for Automotive Lineꢀ
PROFILE FEATURE
Preheat Minimum Temperature (Tsmin
Preheat Maximum Temperature (Tsmax
LEAD-FREE ASSEꢀBLY
)
150°C
200°C
)
Preheat Time (tsmin to tsmax
)
120 seconds
Ramp-Up Rate (TL to Tp)
3°C / second maximum
217°C
Liquidous Temperature (TL)
Time Maintained Above Temperature TL (tL)
Peak / Classification Temperature (Tp)
Time Within 5°C of Actual Peak Temperature (tp)
Ramp-Down Rate (Tp to TL)
150 seconds
260°C
10 to 30 seconds
6°C / second maximum
8 minutes maximum
Time 25°C to Peak Temperature
JEDEC Moisture Sensitivity
Table 9ꢀ Moisture sensitivity levels for LUXEON IR Domed for Automotive Lineꢀ
FLOOR LIFE
SOAk REqUIREꢀENTS STANDARD
LEVEL
TIꢀE
CONDITIONS
TIꢀE
CONDITIONS
1
Unlimited
≤30°C / 85% RH
168 Hours +5 / -0
85°C / 85% RH
DS235 LUXEON IR Domed for Automotive Product Datasheet 20191124 ©2019 Lumileds Holding B.V. All rights reserved.
12
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