Reflow Soldering Guidelines
tp
Tp
Critical ꢂone
L to Tp
Rampꢁup
T
TL
tL
Tsmax
Tsmin
Rampꢁdown
ts
Preheat ꢃrea
25
Time 25ꢀC to Peak
JEDEC JꢁSTDꢁ020D
Time
Figure 11. Visualization of the acceptable reflow temperature profile as specified in Table 8.
Table 8. Reflow profile characteristics for LUXEON CSP HL1.
PROFILE FEATURE
Preheat Minimum Temperature (Tsmin
Preheat Maximum Temperature (Tsmax
LEAD-FREE ASSEMBLY
)
150°C
200°C
)
Preheat Time (tsmin to tsmax
)
60 to 180 seconds
3°C / second maximum
217°C
Ramp-Up Rate (TL to Tp)
Liquidus Temperature (TL)
Time Maintained Above Temperature TL (tL)
Peak / Classification Temperature (Tp)
Time Within 5°C of Peak Temperature (tp)
Ramp-Down Rate (Tp to TL)
60 to 150 seconds
260°C
20 to 40 seconds
6°C / second maximum
8 minutes maximum
Time 25°C to Peak Temperature
Notes for Table 8:
1. All temperatures refer to the application Printed Circuit Board (PCB), measured on the surface adjacent to the package body.
JEDEC Moisture Sensitivity
Table 9. Moisture sensitivity levels for LUXEON CSP HL1.
FLOOR LIFE
SOAK REQUIREMENTS STANDARD
LEVEL
TIME
CONDITIONS
TIME
CONDITIONS
1
Unlimited
≤30°C / 85% RH
168 Hours +5 / -0
85°C / 85% RH
DS186 LUXEON CSP HL1 Product Datasheet 20190722 ©2019 Lumileds Holding B.V. All rights reserved.
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