Reflow Soldering Guidelines
tp
Tp
Critical Zone
L to Tp
Ramp-up
T
TL
tL
Tsmax
Tsmin
Ramp-down
ts
Preheat Area
25
Time 25ºC to Peak
JEDEC J-STD-020D
Time
Figure 11. Visualization of the acceptable reflow temperature profile as specified in Table 8.
Table 8. Reflow profile characteristics for LUXEON UV U Line.
ProFIle Feature
Preheat Minimum Temperature (Tsmin
Preheat Maximum Temperature (Tsmax
lead-Free assemBly
)
150°C
200°C
)
Preheat Time (tsmin to tsmax
)
60 to 120 seconds
3°C / second maximum
217°C
Ramp-Up Rate (TL to Tp)
Liquidus Temperature (TL)
Time Maintained Above Temperature TL (tL)
Peak / Classification Temperature (Tp)
Time Within 5°C of Actual Temperature (tp)
Ramp-Down Rate (Tp to TL)
60 to 150 seconds
260°C
20 to 40 seconds
6°C / second maximum
8 minutes maximum
Time 25°C to Peak Temperature
JEDEC Moisture Sensitivity
Table 9ꢀ Moisture sensitivity levels for LUXEON UV U Lineꢀ
Floor lIFe
soaK requIrements standard
leVel
tIme
condItIons
tIme
condItIons
1
Unlimited
≤30°C / 85% RH
168 Hours +5 / -0
85°C / 85% RH
DS178 LUXEON UV U Line Product Datasheet 20170711 ©2017 Lumileds Holding B.V. All rights reserved.
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