Reflow Soldering Guidelines
tp
Tp
Critical Zone
L to Tp
Ramp-up
T
TL
tL
Tsmax
Tsmin
Ramp-down
ts
Preheat Area
25
Time 25ºC to Peak
JEDEC J-STD-020D
Time
Figure 11. Visualization of the acceptable reflow temperature profile as specified in Table 8.
Table 8. Reflow profile characteristics for LUXEON UV FC Line (non-AuSn solder system)[1]
ꢀ
ProFIle Feature
lead-Free assemBly
Preheat Minimum Temperature (Tsmin
)
150°C
200°C
Preheat Maximum Temperature (Tsmax
)
Preheat Time (tsmin to tsmax
)
60 to 120 seconds
3°C / second maximum
217°C
Ramp-Up Rate (TL to Tp)
Liquidus Temperature (TL)
Time Maintained Above Temperature TL (tL)
Peak / Classification Temperature (Tp)
Time Within 5°C of Actual Temperature (tp)
Ramp-Down Rate (Tp to TL)
60 to 150 seconds
260°C
20 to 40 seconds
6°C / second maximum
8 minutes maximum
Time 25°C to Peak Temperature
Notes for Table 8:
1. Characteristics are for non-AuSn lead-free solder system only. For AuSn (gold-tin) solder system, see AB116 for more details.
JEDEC Moisture Sensitivity
Table 9ꢀ Moisture sensitivity levels for LUXEON UV FC Lineꢀ
Floor lIFe
soaK requIrements standard
leVel
tIme
condItIons
tIme
168 Hours +5 / -0
condItIons
1
Unlimited
≤30°C / 85% RH
85°C / 85% RH
DS185 LUXEON UV FC Line Product Datasheet 20170710 ©2017 Lumileds Holding B.V. All rights reserved.
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