Reflow Soldering Guidelines
tp
Tp
Critical Zone
L to Tp
Ramp-up
T
TL
tL
Tsmax
Tsmin
Ramp-down
ts
Preheat Area
25
Time 25ºC to Peak
JEDEC J-STD-020D
Time
Figure 10. Visualization of the acceptable reflow temperature profile as specified in Table 8.
Table 8. Reflow profile characteristics for LUXEON 3030 2D.
ProFIlE FEaturE
Preheat Minimum Temperature (Tsmin
Preheat Maximum Temperature (Tsmax
lEaD FrEE assEmBly
)
150°C
200°C
)
Preheat Time (tsmin to tsmax
)
60 to 120 seconds
3°C / second maximum
217°C
Ramp-Up Rate (TL to Tp)
Liquidus Temperature (TL)
Time Maintained Above Temperature TL (tL)
Peak / Classification Temperature (Tp)
Time Within 5°C of Actual Temperature (tp)
Ramp-Down Rate (Tp to TL)
60 to 150 seconds
260°C
20 to 40 seconds
6°C / second maximum
8 minutes maximum
Time 25°C to Peak Temperature
Notes for Table 8:
1. All temperatures refer to the application Printed Circuit Board (PCB), measured on the surface adjacent to the package body.
JEDEC Moisture Sensitivity
Table 9ꢀ Moisture sensitivity levels for LUXEON 3030 2Dꢀ
Floor lIFE
soak rEquIrEmEnts stanDarD
lEVEl
tImE
conDItIons
tImE
conDItIons
3
168 Hours
30°C / 60% RH
192 Hours +5 / -0
30°C / 60% RH
DS207 LUXEON 3030 2D Product Datasheet 20170209 ©2017 Lumileds Holding B.V. All rights reserved.
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