Reflow Soldering Guidelines
tp
Tp
Critical Zone
L to Tp
Ramp-up
T
TL
tL
Tsmax
Tsmin
Ramp-down
ts
Preheat Area
25
Time 25ºC to Peak
JEDEC J-STD-020D
Time
Figure 10. Visualization of the acceptable reflow temperature profile as specified in Table 8.
Table 8. Reflow profile characteristics for LUXEON 3030 HV.
ProFIlE FEaturE
Preheat Minimum Temperature (Tsmin
Preheat Maximum Temperature (Tsmax
Preheat Time (tsmin to tsmax
lEad-FrEE assEmBly
)
150°C
200°C
)
)
60 to 120 seconds
3°C / second maximum
217°C
Ramp-Up Rate (Tsmax to Tp)
Liquidous Temperature (TL)
Time Maintained Above Temperature TL (tL)
Peak / Classification Temperature (Tp)
Time Within 5°C of Actual Peak Temperature (tp)
Ramp-Down Rate
60 to 150 seconds
260°C
20 to 40 seconds
6°C / second maximum
8 minutes maximum
Time 25°C to Peak Temperature
JEDEC Moisture Sensitivity
Table 9. Moisture sensitivity levels for LUXEON 3030 HV.
Floor lIFE
soak rEquIrEmEnts standard
lEVEl
tImE
condItIons
tImE
condItIons
3
168 Hours
30°C / 60% RH
192 Hours +5/-0
30°C / 60% RH
DS215 LUXEON 3030 HV Product Datasheet 20200405 ©2020 Lumileds Holding B.V. All rights reserved.
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