Reflow Soldering Guidelines
tp
Tp
Critical Zone
L to Tp
Ramp-up
T
TL
tL
Tsmax
Tsmin
Ramp-down
ts
Preheat Area
25
Time 25ºC to Peak
JEDEC J-STD-020D
Time
Figure 10. Visualization of the acceptable reflow temperature profile as specified in Table 8.
Table 8. Reflow profile characteristics for LUXEON 2835 with CrispColor Technology.
PꢄoFIlE FEatuꢄE
Preheat Minimum Temperature (Tsmin
Preheat Maximum Temperature (Tsmax
lEad-FꢄEE aꢅꢅEmBlꢆ
)
150°C
200°C
)
Preheat Time (tsmin to tsmax
)
60 to 120 seconds
3°C / second maximum
217°C
Ramp-Up Rate (TL to Tp)
Liquidus Temperature (TL)
Time Maintained Above Temperature TL (tL)
Peak / Classification Temperature (Tp)
Time Within 5°C of Actual Temperature (tp)
Ramp-Down Rate (Tp to TL)
60 to 150 seconds
260°C
20 to 40 seconds
6°C / second maximum
8 minutes maximum
Time 25°C to Peak Temperature
JEDEC Moisture Sensitivity
Table 9. Moisture sensitivity levels for LUXEON 2835 with CrispColor Technology.
Flooꢄ lIFE
ꢅoak ꢄEquIꢄEmEntꢅ ꢅtandaꢄd
lEVEl
tImE
CondItIonꢅ
tImE
CondItIonꢅ
3
168 Hours
≤30°C / 60% RH
192 Hours +5 / -0
30°C / 60% RH
DS193 LUXEON 2835 with CrispColor Technology Product Datasheet 20200405 ©2020 Lumileds Holding B.V. All rights reserved.
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