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AB20-4 参数 Datasheet PDF下载

AB20-4图片预览
型号: AB20-4
PDF下载: 下载PDF文件 查看货源
内容描述: 热管理注意事项食人鱼LED灯 [Thermal Management Considerations for SuperFlux LEDs]
分类和应用:
文件页数/大小: 14 页 / 267 K
品牌: LUMILEDS [ LUMILEDS LIGHTING COMPANY ]
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The resistors should be located in a remote  
portion of the PCB (away from the LEDs), on a  
separate PCB, or in the wire harness if possible.  
If this is not possible, the resistors should be  
distributed evenly along the PCB to distribute  
the heat generated. In addition, the traces from  
resistors to metallized areas surrounding  
cathode leads on the LEDs should be  
minimized to prevent resistors from heating  
adjacent LEDs. This can be accomplished by  
thinning down these traces, or by having  
metallized areas contacting the LEDs and  
resistors only contact the anode leads of the  
LED. A portion of an LED CHMSL PCB depicting  
the design concepts discussed is shown in  
Figure 4.6.  
LED Spacing  
Most of the electrical power in an LED is  
dissipated as heat. Tighter LED spacing  
provides a smaller area for heat dissipation,  
resulting in higher PCB temperatures and thus  
higher junction temperatures. The LEDs should  
be spaced as far apart as packaging and  
optical constraints will allow. Most CHMSL  
applications use only a single row of LEDs at  
spacing greater than 15 mm which is ideal, as  
opposed to many amber turn signal applications  
which use a tightly spaced (less than 10 mm) xꢀy  
array of LEDs.  
Lamp Housing Design and Mounting of the LED Array  
LED lamp housings should be designed to  
provide a conductive path from the backside of  
the PCB to the lamp housing. This is typically  
accomplished by mounting the backside of the  
PCB directly to the lamp housing such that they  
are contacting one another across the entire  
length of the PCB. This mounting scheme can  
be improved by applying a thermally conductive  
pad between the PCB and the lamp housing.  
The thermally conductive pad conforms to the  
features on the backside of the PCB and  
PCB along its top and bottom edges to slots in  
the side of the lamp housing. Again, the area for  
conduction into the lamp housing is reduced to  
the contact areas of the slots, which reduces the  
effectiveness of conduction.  
If the PCB is mounted in such a way that  
conduction to the lamp housing is not effective  
(trapped air is a very poor conductor of heat),  
then allowances for convective cooling should be  
made. The most common technique to take  
advantage of natural convection is to put holes in  
the top and bottom side of the lamp housing to  
allow for vertical air flow over the PCB. However,  
where the lamp housing must be sealed for  
environmental reasons, this type of approach is  
impractical.  
provides a larger contact area for conduction.  
Often the PCB is mounted to the lamp housing  
on top of raised bosses. In this case, the area  
for conduction into the lamp housing is reduced  
to the contact area on the top side of the  
bosses, greatly reducing its effectiveness.  
Another common configuration mounts the  
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