Reflow Soldering Guidelines
Figure 9. Visualization of the acceptable reflow temperature profile as specified in Table 8.
Table 8. Reflow profile characteristics for SignalSure 250.
PROFILE FEATURE
LEAD FREE ASSEMBLY
Preheat Minimum Temperature (Tsmin
)
150°C
200°C
Preheat Maximum Temperature (Tsmax
)
Ramp-Up Rate (Tp to TL)
3°C / second maximum
60 to 180 seconds
217°C
Preheat Time (tsmin to tsmax
)
Liquidous Temperature (TL)
Time Maintained Above Temperature TL (tL)
Peak / Classification Temperature (Tp)
Time Within 5°C of Actual Peak Temperature (tp)
Ramp-Down Rate (Tp to TL)
60 to 150 seconds
260°C
20 to 40 seconds
6°C / second maximum
8 minutes maximum
Time 25°C to Peak Temperature
Notes for Table 8:
1. All temperatures refer to the application Printed Circuit Board (PCB), measured on the surface adjacent to the package body.
JEDEC Moisture Sensitivity
Table 9. Moisture sensitivity levels for SignalSure 250.
FLOOR LIFE [1]
SOAK REQUIREMENTS STANDARD
LEVEL
TIME
CONDITIONS
TIME
CONDITIONS
2
1 Year
≤30°C / 60% RH
168 Hours +5 / -0
85°C / 60% RH
Notes for Table 9:
1. Shelf life 2 years.
DS148 SignalSure 250 Product Datasheet 20190927 ©2019 Lumileds Holding B.V. All rights reserved.
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