LMU08/8U
DEVICES INCORPORATED
8 x 8-bit Parallel Multiplier
NOTES
1. Maximum Ratings indicate stress 9. AC specifications are tested with
11. For the tENA test, the transition is
specifications only. Functional oper- input transition times less than 3 ns, measured to the 1.5 V crossing point
ationoftheseproductsatvaluesbeyond output reference levels of 1.5 V (except
those indicated in the Operating Condi-
with datasheet loads. For the tDIS test,
the transition is measured to the
tDIS test), and input levels of nominally
tions table is not implied. Exposure to 0 to 3.0 V. Output loading may be a ±200mV level from the measured
maximum rating conditions for ex- resistive divider which provides for steady-state output voltage with
tended periods may affect reliability.
±10mA loads. The balancing volt-
age, VTH, is set at 3.5 V for Z-to-0
specified IOH and IOL at an output
voltage of VOH min and VOL max
2. The products described by this spec-
ification include internal circuitry de-
signedto protect the chipfrom damag-
ing substrate injection currents and ac-
cumulationsofstaticcharge. Neverthe-
less, conventional precautions should
be observed during storage, handling,
and use of these circuits in order to This device has high-speed outputs ca-
avoid exposure to excessive electrical pable of large instantaneous current
respectively. Alternatively, a diode and 0-to-Z tests, and set at 0 V for Z-
bridge with upper and lower current to-1 and 1-to-Z tests.
sources of IOH and IOL respectively,
12. These parameters are only tested at
and a balancing voltage of 1.5 V may be
the high temperature extreme, which is
used. Parasitic capacitance is 30 pF
the worst case for leakage current.
minimum, and may be distributed.
FIGURE A. OUTPUT LOADING CIRCUIT
stress values.
pulses and fast turn-on/turn-off times.
Asaresult, caremustbeexercisedinthe
testing of this device. The following
measures are recommended:
S1
DUT
3. Thisdeviceprovideshardclampingof
transient undershoot and overshoot. In-
put levels below ground or above VCC
I
OL
V
TH
CL
I
OH
will be clamped beginning at –0.6 V and a. A 0.1 µF ceramic capacitor should be
VCC + 0.6 V. The device can withstand installed between VCC and Ground
indefinite operation with inputs in the leads as close to the Device Under Test
range of –0.5 V to +7.0 V. Device opera- (DUT) as possible. Similar capacitors
FIGURE B. THRESHOLD LEVELS
t
ENA
tDIS
tion will not be adversely affected, how-
ever, input current levels will be well in and the tester common, and device
should be installed between device VCC
OE
0
1.5 V
1.5 V
excess of 100 mA.
ground and tester common.
Z
Z
3.5V Vth
1.5 V
1.5 V
V
OL*
0.2 V
0.2 V
0
1
Z
Z
4. Actualtestconditionsmayvaryfrom
b. Ground and VCC supply planes
those designated but operation is guar- must be brought directly to the DUT
anteed as specified. socket or contactor fingers.
V
OH*
1
0V Vth
VOL*
Measured VOL with IOH = –10mA and IOL = 10mA
5. Supply current for a given applica- c. Input voltages should be adjusted to
V
OH* Measured VOH with IOH = –10mA and IOL = 10mA
tioncanbeaccuratelyapproximatedby:
compensateforinductivegroundand VCC
noise to maintain required DUT input
levels relative to the DUT ground pin.
2
NCV F
4
where
10. Each parameter is shown as a min-
imum or maximum value. Input re-
quirements are specified from the point
of view of the external system driving
the chip. Setup time, for example, is
specified as a minimum since the exter-
nal system must supply at least that
much time to meet the worst-case re-
quirementsofallparts. Responsesfrom
the internal circuitry are specified from
the point of view of the device. Output
delay, for example, is specified as a
maximumsinceworst-caseoperationof
anydevicealwaysprovidesdatawithin
that time.
N = total number of device outputs
C = capacitive load per output
V = supply voltage
F = clock frequency
6. Tested with all outputs changing ev-
ery cycle and no load, at a 5 MHz clock
rate.
7. Tested with all inputs within 0.1 V of
VCC or Ground, no load.
8. These parameters are guaranteed
but not 100% tested.
Multipliers
08/16/2000–LDS.08/8U-R
5
LOGIC [ LOGIC DEVICES INCORPORATED ]
