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L9D112G80BG4I10 参数 Datasheet PDF下载

L9D112G80BG4I10图片预览
型号: L9D112G80BG4I10
PDF下载: 下载PDF文件 查看货源
内容描述: 1.2 GB , DDR - SDRAM集成模块 [1.2 Gb, DDR - SDRAM Integrated Module]
分类和应用: 内存集成电路动态存储器双倍数据速率时钟
文件页数/大小: 45 页 / 6016 K
品牌: LOGIC [ LOGIC DEVICES INCORPORATED ]
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PreLIMINArY INforMAtIoN L9D112G80BG4  
1.2 Gb, DDR - SDRAM Integrated Module (IMOD)  
Pin/Ba l l lo c a t io n s /DeFinitions a n D Fu n c t io n a l De s c r iP t io n  
BGA Locations  
Symbol  
Type  
Description  
F4, F16, G5, G15, K1,  
Clock: CKx and CKx\ are differential clock inputs. All address and control input signals are  
CNTL. Input  
CKX,CKX\  
K12, L2, L13, N6, M8  
G4, G16, K2, K13, M6  
sampled on the crossing of the positive edge of CKx and negative edge of CKx\. Output data  
(DQ’s and DQS) is referenced to the crossings of the differential clock inputs.  
Clock Enable: CKE controls the clock inputs. CKE High enables, CKE Low disables the clock  
input pins. Driving CKE Low provides PRECHARGE POWER-DOWN. CKE is synchronous  
for POWER-DOWN entry and exit, and for SELF-REFRESH entry CKE is asynchronous for  
SELF-REFRESH exit and disabling the outputs. CKE must be maintained High throughout  
READ and WRITE accesses. Input buffers are disabled during POWER-DOWN, input buffers  
are disabled during SELF-REFRESH. CKE is an SSTL-2 input but will detect an LVCMOS  
LOW level after VCC is applied.  
CNTL. Input  
CKEx  
G1, G13, K4, K16, M12  
Chip Select: CSx\ enables the COMMAND register(s) of each of the five (5) integrated  
words. All commands are masked (registered) HIGH with CSx\ driven true. CSx\ provides for  
external word/bank selection on systems with multiple banks. CSx\ is considered part of the  
COMMAND CODE.  
CNTL. Input  
CSX\  
F12, G2, K15, L5, M11  
F1, G12, L4, L16, M9  
F2, F13, L15, M4, M10  
E2, E4, E13, F15, M2,  
M5, M7, M13, M15, N11  
Row Address Strobe: Command input along with CASx\ and WEx\  
CNTL. Input  
CNTL. Input  
CNTL. Input  
CNTL. Input  
RASX\  
CASX\  
WEX\  
Column Address Strobe: Command input along with RASx\ and WEx\  
WRITE (word): Command input along with CASx\ and RASx\  
Input Data Mask: DQM is an input mask signal for WRITE operations. Input Data is masked  
when DQML/Hx is sampled HIGH at time of a WRITE access DQML/Hx is sampled on both  
edges of DQSL/Hx.  
DQMLX,  
DQMHX  
E5, E6, E7, E10, E11,  
F5, K5, L12, N5, N12  
E12  
Data Strobe: Output flag on READ data and Input flag on WRITE data. DQS is edge-aligned  
with READ data, centered in WRITE data operations.  
DQSLX,  
DQSHX  
Vref  
Reference Voltage  
Level REF  
Input  
A7, A8, A9, A10, B7, B8,  
B9, B10, C7, C8, C9,  
C10, D7  
Address input: Provide the ROW address for ACTIVE commands and the COLUMN address  
and AUTO PRE-CHARGE bit (A10) for READ/WRITE commands to select one location out of  
the total array within a selected bank A10 sampled during a PRE-CHARGE command deter-  
mines whether the PRE-CHARGE applies to one bank or all banks. The address inputs also  
provide the OP-CODE during a MODE REGISTER SET command.  
A0-A12  
E8, E9  
Bank Address input: define which BANK is active during a READ, WRITE, or PRE-CHARGE  
command.  
Input  
BA0, BA1  
LOGIC Devices Incorporated  
www.logicdevices.com  
High Performance, Integrated Memory Module Product  
4
Feb 2, 2009 LDS-L9D112G80BG4-C