300U(R)
2). Forward Conduction
Parameters
I
F(AV)
Max. average forward current
@ Case temperature
6F(R)
300
130
6550
I
FSM
Max. peak, one-cycle forward,
non-repetitive surge current
6850
5500
5750
214
It
2
Unit
A
℃
Conditions
180
°
conduction, half sine wave
t = 10ms
No voltage
reapplied
100% V
RRM
reapplied
No voltage
reapplied
100% V
RRM
reapplied
Sinusoidal half wave,
Initial T
J
= T
J
max.
A
t = 8.3ms
t = 10ms
t = 8.3ms
t = 10ms
Maximum I t for fusing
2
195
151
138
KA s
2
t = 8.3ms
t = 10ms
t = 8.3ms
I
2
√
t
Maximum I
2
√
t for fusing
2140
0.610
0.751
--
1.40
-65 to 200
-65 to 200
0.18
0.08
37
28
250
KA
2
√
s t = 0.1 to 10ms, no voltage reapplied
V
m
Ω
V
V
℃
DC operation
Mounting surface, smooth, flat and greased
Not lubricated threads
Lubricated threads
T
J
= 200
℃
(I
FM
x
π
x I
F(AV)
(785A peak), T
J
= 25
℃
(I
FM
x
π
x I
F(AV)
(942A peak), T
J
= 25
℃
V
F(TO)
Max. value of threshold voltage
r
f
V
FM
T
J
T
stg
R
thJC
R
thCS
T
wt
Max. value of forward slope resistance
Max. peak forward voltage
Max. junction operating temperature range
Max. storage temperature range
Max. thermal resistance, junction to case
Max. thermal resistance, case to heatsink
Mounting torque,
±
10%
Approximate weight
Case style
K/W
Nm
g
DO-9
See Outline Table
Δ
R
thJC
Conduction
(The following table shows the increment of thermal resistence R
thJC
when devices operate at different conduction angles than DC)
Conduction angle
180
°
120
°
90
°
60
°
30
°
Sinusoidal conduction
0.020
0.024
0.031
0.045
0.077
Rectangular conduction
0.015
0.025
0.034
0.047
0.077
Units
Conditions
K/W
T
J
= T
J
max.
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