Introduction toRadial Lead Fuses
Circuit Protection
TE7 > Time LagTransientology
> 807 Series
Temperature De-rating Curve
807 DE-RATING CURVE
140%
120%
Average Time Current Curves
0.8A
1A
1.25A
1.6A
2A
2.5A
3.15A
4A
5A
1000.000
PERCENT OF RATING
100%
80%
60%
40%
100.000
10.000
20%
0%
-55
-30
-5
20
45
70
95
120
Blowtime [sec].
AMBIENT TEMPERATURE (°C)
1.000
0.100
0.010
0.001
0.1
1
10
CURRENT [A]
6.3A
100
1000
Soldering Parameters - Wave Soldering
300
280
260
240
220
200
180
160
140
120
100
80
60
40
20
100
110
120
130
140
150
160
170
180
190
200
210
220
230
240
10
20
30
40
50
60
70
80
90
0
0
Recommended Process Parameters:
Wave Parameter
Preheat:
Temperature Minimum:
100
˚
C
150
˚
C
60-180 seconds
Solder Pot Temperature:
Solder Dwell Time:
260
˚
2-5 seconds
Lead-Free Recommendation
Temperature (°C) - Measured on bottom side of board
Recommended Hand-Solder Parameters:
Solder Iron Temperature: 350˚C ± 5˚C
Note: These devices are not recommended for IR or
Convection Reflow Process.
Time (Seconds)
Preheat Time
Dwell Time
Cooling Time
TE-UMF 807 Series
2
© 2009 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/series/807.html for current information.
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