Transient Voltage Suppression Diodes
Axial Leaded – 20000W
Soldering Parameters
Reflow Condition
- Temperature Min (T
s(min)
)
Pre Heat
- Temperature Max (T
s(max)
)
- Time (min to max) (t
s
)
Average ramp up rate (Liquidus Temp
(T
L
) to peak
T
S(max)
to T
L
- Ramp-up Rate
Reflow
- Temperature (T
L
) (Liquidus)
- Time (min to max) (t
s
)
260
+0/-5
°C
3°C/second max
3°C/second max
217°C
25˚C
t 25˚C to Peak
T
P
t
p
Ramp-up
Critical Zone
T
L
to T
P
150°C
Temperature (T)
T
L
T
s(max)
200°C
t
L
Ramp-down
T
s(min)
t
s
Preheat
Time (t)
Peak Temperature (T
P
)
Time within 5°C of actual peak
Temperature (t
p
)
Ramp-down Rate
Time 25°C to peak Temperature (T
P
)
Do not exceed
Flow/Wave Soldering (Solder Dipping)
6°C/second max
8 minutes Max.
280°C
Peak Temperature :
Dipping Time :
Soldering :
265
O
C
10 seconds
1 time
Physical Specifications
Weight
Case
Polarity
Terminal
0.07oz., 2.5g
P600 molded plastic body over
Color band denotes the cathode except
Bipolar.
Matte Tin axial leads, solderable per
Environmental Specifications
Temperature Cycle
Pressure Cooker
High Temp. Storage
HTRB
Thermal Shock
Dimensions
D
C
A
A
P600
Dimensions
A
B
C
D
Inches
Min
1.000
0.340
0.048
0.340
Max
-
0.360
0.052
0.360
Millimeters
Min
25.40
8.60
1.22
8.60
Max
-
9.10
1.32
9.10
B
20KPA Series
Specifications are subject to change without notice.
97
www.littelfuse.com
©2007 Littelfuse
LITTELFUSE [ LITTELFUSE ]
