POLYFUSE
®
Resettable PTCs
Surface Mount
Soldering Parameters
Condition
Peak Temp/ Duration Time
Time above liquids (TAL) 220°C
Preheat 120°C~ 180°C
Storage Condition
Reflow
260°C/10Sec
60Sec~100Sec
Temperature (°C)
260
220
Soldering
Cooling
50Sec~150Sec
0°C~35°C,< 70%RH
=
• ecommendedreflowmethods:IR,vaporphaseoven,hotair
R
oven,N
2
environmentforlead-free
• evicesarenotdesignedtobewavesolderedtothebottomside
D
oftheboard.
• ecommendedmaximumpastethicknessis0.25mm(0.010inch)
R
• evicescanbecleanedusingstandardindustrymethodsand
D
solvents.
Note:
freflowtemperaturesexceedtherecommendedprofile,
I
devicesmaynotmeettheperformancerequirements.
180
120
Preheating
0
50 to 150
60 to 100
Time(s)
120
Physical Specifications
Terminal Material
Lead Solderability
Gold-PlatedCopperorSolder-Plated
Copper(SolderMaterial:MatteTin(Sn))
MeetsEIASpecificationRS186-9E,ANSI/
J-STD-002Category3.
Environmental Specifications
Operating/Storage
Temperature
Maximum Device Surface
Temperature in Tripped State
Passive Aging
Humidity Aging
-40°Cto+85°C
125°C
+85°C,1000hours
±5%typicalresistancechange
+85°C,85%R.H.1000hours
±5%typicalresistancechange
MIL-STD-202Method107G
+85°C/-40°C20times
-30%typicalresistancechange
MIL-STD-202,Method215
Nochange
MIL-STD-883C,Method2007.1,
ConditionA
Nochange
Thermal Shock
Solvent Resistance
Vibration
0805L Series
Specifications are subject to change without notice.
Electronics Designers Guide
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©2006 Littelfuse
LITTELFUSE [ LITTELFUSE ]
