Introduction to & Cartridge Fuses
Axial Lead Circuit Protection
Transientology
3AB > Fast-Acting > 505 Series
Temperature Rerating Curve
Average Time Current Curves
10A
12A
16A
20A
25A
30A
10000
1000
100
TIME IN SECONDS
10
1
0.1
0.01
0.001
1
10
100
1000
CURRENT IN AMPERES
Soldering Parameters - Wave Soldering
300
Temperature (°C) - Measured on bottom side of board
280
260
240
220
200
180
160
140
120
100
80
60
40
20
100
110
120
130
140
150
160
170
180
190
200
210
220
230
240
10
20
30
40
50
60
70
80
90
0
0
Recommended Process Parameters:
Wave Parameter
Preheat:
(Depends on Flux Activation
Temperature)
(Typical Industry Recommendation)
Lead-Free Recommendation
Temperature
Minimum:
Temperature
Maximum:
Preheat
Time:
Solder Pot Temperature:
Solder Dwell Time:
100
°
C
150
°
C
60-180 seconds
260
°
C Maximum
2-5 seconds
Recommended Hand-Solder Parameters:
Solder Iron
Temperature:
350° C +/-
5°C
Heating
Time: 5
seconds max.
Note: These devices are not recommended for IR or
Convection Reflow process.
Time (Seconds)
Preheat Time
Dwell Time
Cooling Time
505 Series
338
Revised: January 20, 2009
© 2009 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/series/505.html for current information.
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