Surface Mount Fuses
Introduction to Circuit Protection
NANO2® > 250V UMF Time Lag > 465 Series
Transientology
Temperature Rerating Curve
AverageTime Current Curves
100
10
1
0.1
/PUFꢔ
ꢄꢍꢀ %FSBUJOHꢀEFQJDUFEꢀJOꢀUIJTꢀDVSWFꢀJTꢀJOꢀBEEJUJPOꢀUPꢀUIFꢀTUBOEBSEꢀEFSBUJOHꢀPGꢀꢄꢋꢌꢀGPSꢀ
DPOUJOVPVTꢀPQFSBUJPOꢍ
0.01
0.001
1000
0.1
1
10
100
CURRENT IN AMPERES
Soldering Parameters
tP
Reflow Condition
-Temperature Min (Ts(min)
1Cꢀoꢀ'SFFꢀBTTFNCMZ
TP
Critical Zone
Ramp-up
TL to TP
)
ꢄꢋꢃ¡$ꢀ
TL
Pre Heat -Temperature Max (Ts(max)
)
ꢅꢃꢃ¡$
tL
TS(max)
-Time (Min to Max) (ts)
ꢂꢃꢀoꢀꢄꢅꢃꢀTFDT
Ramp-down
Average ramp up rate (LiquidusTemp
(TL) to peak
Preheat
ꢋ¡$ꢏTFDPOEꢀNBYꢍ
TS(min)
tS
TS(max) toTL - Ramp-up Rate
ꢋ¡$ꢏTFDPOEꢀNBYꢍ
ꢅꢄꢆ¡$ꢀ
-Temperature (TL) (Liquidus)
Reflow
25
time to peak temperature
(t 25ºC to peak)
-Temperature (tL)
ꢂꢃꢀoꢀꢒꢃꢀTFDPOET
ꢅꢋꢃꢓꢃꢏꢁꢋꢀ¡$
Time
PeakTemperature (TP)
Time within 5°C of actual peak
Temperature (tp)
ꢅꢃꢀoꢀꢇꢃꢀTFDPOET
Ramp-down Rate
ꢋ¡$ꢏTFDPOEꢀNBYꢍ
ꢐꢀNJOVUFTꢀNBYꢍ
ꢅꢂꢃ¡$
Time 25°C to peakTemperature (TP)
Do not exceed
ꢅꢂꢃ¡$ꢀ1FBLꢀ
5FNQFSBUVSFꢈꢀ
ꢑꢀTFDPOETꢀNBYꢍ
Wave Soldering Parameters
© 2009 Littelfuse, Inc.
465 Series
82
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/series/465.html for current information.
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