Surface Mount Fuses
NANO2® > Very Fast-Acting > 451/453 Series
Temperature Rerating Curve
Average Time Current Curves
100
10
1
0.1
0.01
Note:
1.ꢀDeratingꢀdepictedꢀinꢀthisꢀcurveꢀisꢀinꢀadditionꢀtoꢀtheꢀstandardꢀderatingꢀofꢀ25%ꢀforꢀ
continuous operation.
0.001
0.05 0.1
1
10
100
1000
CURRENT IN AMPERES
Soldering Parameters
tP
Reflow Condition
- Temperature Min (T
Pb – Free assembly
TP
Critical Zone
Ramp-up
TL to TP
)
150°C
s(min)
TL
Pre Heat - Temperature Max (T
)
200°C
tL
s(max)
TS(max)
- Time (Min to Max) (ts)
60 – 120 secs
Ramp-down
Average ramp up rate (Liquidus Temp
(TL) to peak
Preheat
5°C/second max.
TS(min)
tS
TS(max) to TL - Ramp-up Rate
5°C/second max.
- Temperature (TL) (Liquidus) 217°C
25
Reflow
time to peak temperature
(t 25ºC to peak)
- Temperature (tL)
60 – 90 seconds
250+0/-5 °C
Time
Peak Temperature (TP)
Time within 5°C of actual peak
Temperature (tp)
20 – 40 seconds
Ramp-down Rate
5°C/second max.
8 minutes max.
260°C
Time 25°C to peak Temperature (TP)
Do not exceed
260°CꢀPeakꢀ
Temperature,
10 seconds max.
Wave Soldering Parameters
© 2009 Littelfuse, Inc.
451/453 Series
59
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/series/451.html
or /453.html for current information.
LITTELFUSE [ LITTELFUSE ]
