Surface Mount Fuses
NANO
2®
> Very Fast-Acting > 448 Series
Temperature Rerating Curve
Average Time Current Curves
.062 A
.080 A
.100 A
.125 A
.160 A
.200 A
.250 A
.315 A
.375 A
.40 A
.50 A
.63 A
.75 A
.80 A
1.00 A
1.25 A
1.50 A
1.60 A
2.00 A
2.50 A
3.00 A
3.15 A
3.50 A
4.00 A
5.00
A
6.30 A
7A
8A
10 A
12 A
15 A
100
10
TIME IN SECONDS
1
0.1
continuous operation.
0.01
0.001
0.1
1
10
100
1000
CURRENT IN AMPS
Soldering Parameters
Reflow Condition
- Temperature Min (T
s(min)
)
- Time (Min to Max) (t
s
)
Average ramp up rate (Liquidus Temp
(T
L
) to peak
T
S(max)
to T
L
- Ramp-up Rate
Reflow
- Temperature (T
L
) (Liquidus)
- Temperature (t
L
)
60 – 90 seconds
250
+0/-5
T
P
Ramp-up
t
P
Critical Zone
T
L
to T
P
60 – 120 secs
Temperature
Pre Heat
- Temperature Max (T
s(max)
)
T
L
T
S(max)
Preheat
t
L
Ramp-down
T
S(min)
t
S
25
time to peak temperature
(t 25ºC to peak)
Time
Peak Temperature (T
P
)
Time within 5°C of actual peak
Temperature (t
p
)
Ramp-down Rate
Time 25°C to peak Temperature (T
P
)
Do not exceed
20 – 40 seconds
8 minutes max.
Wave Soldering Parameters
Temperature, 10
seconds max.
© 2012 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/series/448.html for current information.
448 Series
448 Series
LITTELFUSE [ LITTELFUSE ]
