Introduction to Circuit Protection
Axial Lead & Cartridge Fuses
Transientology
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Temperature Rerating Curve
AverageTime Current Curves
1000
100
10
1
0.1
0.01
0.1
1
1000
10
100
CURRENT IN AMPERES
Soldering Parameters -Wave Soldering
300
280
260
240
220
200
180
160
140
120
100
80
Recommended Process Parameters:
Wave Parameter
Preheat:
(Depends on Flux ActivationTemperature)
Temperature Minimum:
Temperature Maximum:
PreheatTime:
Lead-Free Recommendation
(Typical Industry Recommendation)
100° C
150° C
60-180 seconds
Solder PotTemperature:
Solder DwellTime:
260° C Maximum
2-5 seconds
60
40
20
0
Recommended Hand-Solder Parameters:
Time (Seconds)
Preheat Time
Dwell Time
Cooling Time
Solder IronTemperature: 350° C +/- 5°C
HeatingTime: 5 seconds max.
Note: These devices are not recommended for IR or
Convection Reflow process.
© 2009 Littelfuse, Inc.
388 Series
334
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/series/388.html for current information.
Revised: January 7, 2009
LITTELFUSE [ LITTELFUSE ]
