Introduction to Circuit
Lead Fuses
Axial
Protection
Transientology
5×20 mm > Fast-Acting > 216SP Series
Temperature Rerating Curve
Average Time Current Curves
10000
1000
100
10
1
0.1
0.01
0.001
Time (seconds)
0.01
0.1
1
1.6A
2A
2.5A
3.15A
4A
5A
6.3A
8A
10A
1A
10
100
Amps
Soldering Parameters - Wave Soldering
300
Temperature (°C) - Measured on bottom side of board
280
260
240
220
200
180
160
140
120
100
80
60
40
20
100
110
120
130
140
150
160
170
180
190
200
210
220
230
240
10
20
30
40
50
60
70
80
90
0
0
Recommended Process Parameters:
Wave Parameter
Preheat:
(Depends on Flux Activation Temperature)
(Typical Industry Recommendation)
Lead-Free Recommendation
Temperature Minimum:
Temperature Maximum:
Preheat Time:
Solder Pot Temperature:
Solder Dwell Time:
100
°
C
150
°
C
60-180 seconds
280
°
C Maximum
2-5 seconds
Time (Seconds)
Preheat Time
Dwell Time
Cooling Time
Recommended Hand-Solder Parameters:
Solder Iron Temperature: 350° C +/- 5°C
Heating Time: 5 seconds max.
Note: These devices are not recommended for IR or
Convection Reflow process.
216SP Series
2
© 2009 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/series/216SP.html for current information.
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