LITE-ON TECHNOLOGY CORPORATION
P r o p e r t y o f L i t e - O n O n l y
.
PRODUCT SPECIAL CHARACTERISTICS ( SC ) AND MATERIAL PRODUCT
CONTENTS
CRITICAL POINT
No.
Items
Material
( SC )
N/A
Iron /W Copper + Silver Plating / Solder
1
Lead Frame (Taiwan )
Dip
N/A
2
3
Die Bond ( Japan )
LED Chip ( Taiwan )
Ag Paste
SC for Dice shear
InGaN
SC for Wire pull test &
Bond shear
4
5
Bonding Wire ( America )
Resin ( Taiwan )
Au Wire
N/A
Epoxy Resin
Part No. : LTL2P3TBKL14-MS
BNS-OD-C131/A4
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