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LITE-ON TECHNOLOGY CORPORATION
P r o p e r t y o f L i t e - O n O n l y
CAUTIONS
1. Application
The LEDs described here are intended to be used for ordinary electronic equipment (such as office equipment,
communication equipment and household applications).Consult Liteon’s Sales in advance for information on
applications in which exceptional reliability is required, particularly when the failure or malfunction of the
LEDs may directly jeopardize life or health (such as in aviation, transportation, traffic control equipment,
medical and life support systems and safety devices).
2. Storage
The storage ambient for the LEDs should not exceed 30°C temperature or 70% relative humidity.
It is recommended that LEDs out of their original packaging are used within three months.
For extended storage out of their original packaging, it is recommended that the LEDs be stored in
a sealed container with appropriate desiccant or in desiccators with nitrogen ambient.
3. Cleaning
Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LEDs if necessary.
4. Lead Forming & Assembly
During lead forming, the leads should be bent at a point at least 3 mm from the base of LED lens.
Do not use the base of the lead frame as a fulcrum during forming.
Lead forming must be done before soldering, at normal temperature.
During assembly on PCB, use minimum clinch force possible to avoid excessive mechanical stress.
5. Soldering
When soldering, leave a minimum of 2mm clearance from the base of the lens/Holder to the soldering point.
Dipping the lens/Holder into the solder must be avoided.
Do not apply any external stress to the lead frame during soldering while the LED is at high temperature.
Recommended soldering conditions :
Soldering iron
Wave soldering
100°C Max.
Temperature
350°C Max.
Pre-heat
Soldering time
3 sec. Max.
(one time only)
Pre-heat time
Solder wave
Soldering time
60 sec. Max.
265°C Max.
5 sec. Max.
Note: Excessive soldering temperature and/or time might result in deformation of the LED/Holder or
catastrophic failure of the CBI. IR(Hot air) re-flow is not suitable process for through hole type LED lamp
production. Max. temperature of wave soldering is not mean that Holder’s HDT/Melting temperature.
Part No. : LTL-14CM1H79
BNS-OD-C131/A4
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LITEON [ LITE-ON TECHNOLOGY CORPORATION ]
