IR Emitter and Detector
LTE-R38386S-ZF-U
8.4. Soldering
Recommended soldering conditions:
Reflow Soldering
Soldering iron
Pre-heat
150~200°C
Temperature
Soldering time
300°C Max.
Pre-heat time
Peak temperature
Soldering time
120 seconds Max.
260°C Max.
3 seconds Max.
(one time one)
10 seconds Max.(Max. two times)
Because different board designs use different number and types of devices, solder pastes, reflow ovens, and circuit boards, no
single temperature profile works for all possible combinations.
However, you can successfully mount your packages to the PCB by following the proper guidelines and PCB-specific
characterization.
LITE-ON Runs both component-level verification using in-house KYRAMX98 reflow chambers and board-level assembly.
The results of this testing are verified through post-reflow reliability testing.
Profiles used at LITE-ON are based on JEDEC standards to ensure that all packages can be successfully and reliably surface
mounted.
Figure on page3 shows a sample temperature profile compliant to JEDEC standards.
You can use this example as a generic target to set up your reflow process.
You should adhere to the JEDEC profile limits as well as specifications and recommendations from the solder paste
manufacturer to avoid damaging the device and create a reliable solder joint.
8.5. Drive Method
An LED is a current-operated device. In order to ensure intensity uniformity on multiple LEDs connected in parallel in an
application, it is recommended that a current limiting resistor be incorporated in the drive circuit, in series with each LED as
shown in Circuit A below.
Circuit model (A)
Circuit model (B)
LED
LED
(A) Recommended circuit
(B) The brightness of each LED might appear different due to the differences in the I-V characteristics of those LEDs.
9. Others
The appearance and specifications of the product may be modified for improvement, without prior notice.
Part No. : LTE-R38386S-ZF-U
BNS-OD-FC 002/A4
6/6
LITEON [ LITE-ON TECHNOLOGY CORPORATION ]
