LTC1731-8.2/LTC1731-8.4
U
PACKAGE DESCRIPTION
MS8 Package
8-Lead Plastic MSOP
(Reference LTC DWG # 05-08-1660)
0.889 ± 0.127
(.035 ± .005)
5.23
(.206)
MIN
3.2 – 3.45
(.126 – .136)
3.00 ± 0.102
(.118 ± .004)
(NOTE 3)
0.52
(.206)
REF
0.65
(.0256)
BSC
0.42 ± 0.04
(.0165 ± .0015)
8
7 6 5
TYP
RECOMMENDED SOLDER PAD LAYOUT
3.00 ± 0.102
(.118 ± .004)
NOTE 4
4.88 ± 0.1
(.192 ± .004)
DETAIL “A”
0.254
(.010)
0° – 6° TYP
GAUGE PLANE
1
2
3
4
0.53 ± 0.015
(.021 ± .006)
1.10
(.043)
MAX
0.86
(.34)
REF
DETAIL “A”
0.18
(.077)
SEATING
PLANE
0.22 – 0.38
(.009 – .015)
0.13 ± 0.05
(.005 ± .002)
0.65
(.0256)
BCS
MSOP (MS8) 1001
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
sn1731 17318fs
10
LITEON [ LITE-ON TECHNOLOGY CORPORATION ]
