LITE-ON TECHNOLOGY CORPORATION
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ESD-damaged LEDs will exhibit abnormal characteristics such as high reverse leakage current, low forward
voltage, or “ no lightup ” at low currents.
To verify for ESD damage, check for “ lightup ” and Vf of the suspect LEDs at low currents.
The Vf of “ good ” LEDs should be >2.0V@0.1mA for InGaN product and >1.4V@0.1mA for AlInGaP product.
7. Reliability Test
Test Item
Classification
Test Condition
Reference Standard
Ta= Under Room Temperature As Per Data Sheet
Maximum Rating
*Test Time= 1000HRS (-24HRS,+72HRS)*@20mA.
MIL-STD-750D:1026
MIL-STD-883D:1005
JIS C 7021:B-1
Operation Life
High Temperature
High Humidity
Storage
IR-Reflow In-Board, 2 Times
Ta= 65±5℃,RH= 90～95%
*Test Time= 240HRS±2HRS
MIL-STD-202F:103B
JIS C 7021:B-11
Endurance
Test
Ta= 105±5℃
*Test Time= 1000HRS (-24HRS,+72HRS)
High Temperature
Storage
MIL-STD-883D:1008
JIS C 7021:B-10
Ta= -55±5℃
*Test Time=1000HRS (-24HRS,+72H RS)
Low Temperature
Storage
JIS C 7021:B-12
MIL-STD-202F:107D
MIL-STD-750D:1051
MIL-STD-883D:1010
JIS C 7021:A-4
105℃ ～ 25℃ ～ -55℃ ～ 25℃
Temperature
Cycling
30mins 5mins
10 Cycles
30mins 5mins
IR-Reflow In-Board, 2 Times
85 ± 5℃ ～ -40℃ ± 5℃
MIL-STD-202F:107D
MIL-STD-750D:1051
MIL-STD-883D:1011
Thermal
Shock
10mins
10mins 10 Cycles
MIL-STD-202F:210A
MIL-STD-750D:2031
JIS C 7021:A-1
T.sol= 260 ± 5℃
Dwell Time= 10 ± 1secs
Solder
Resistance
Ramp-up rate(183℃ to Peak) +3℃/ second max
Temp. maintain at 125(±25)℃ 120 seconds max
Temp. maintain above 183℃ 60-150 seconds
Peak temperature range 235℃+5/-0℃
Time within 5°C of actual Peak Temperature (tp)
10-30 seconds
MIL-STD-750D:2031.2
J-STD-020C
IR-Reflow
Normal Process
Environmental
Test
Ramp-down rate +6℃/second max
Ramp-up rate(217℃to Peak) +3℃/ second max
Temp. maintain at 175(±25)℃180 seconds max
Temp. maintain above 217℃60-150 seconds
Peak temperature range 260℃+0/-5℃
Time within 5°C of actual Peak Temperature (tp)
20-40 seconds
MIL-STD-750D:2031.2
J-STD-020C
IR-Reflow
Pb Free Process
Ramp-down rate +6℃/second max
MIL-STD-202F:208D
MIL-STD-750D:2026
MIL-STD-883D:2003
IEC 68 Part 2-20
T.sol= 235 ± 5℃
Immersion time 2±0.5 sec
Immersion rate 25±2.5 mm/sec
Coverage ≧95% of the dipped surface
Solderability
JIS C 7021:A-2
8. Others
The appearance and specifications of the product may be modified for improvement without prior notice.
Part No. : LTST-C170KFKT
BNS-OD-C131/A4
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