Moisture Proof Packaging
Baking Conditions
All HSDL-3208 options are
shipped in moisture proof
package. Once opened, moisture
absorption begins.
If the parts are not stored in dry
conditions, they must be baked
before reflow to prevent damage
to the parts.
This part is compliant to JEDEC
Level 4.
Package
In reels
In bulk
Temp.
60°C
Time
≥ 48 hours
≥ 4 hours
≥ 2 hours
≥ 1 hour
100°C
125°C
150°C
UNITS IN A SEALED
MOISTURE-PROOF
PACKAGE
Baking should only be done once.
Recommended Storage
Conditions
PACKAGE IS
OPENED (UNSEALED)
Storage
10°C to 30°C
Temperature
Relative
below 60% RH
Humidity
ENVIRONMENT
LESS THAN 30°C,
AND LESS THAN
60% RH
YES
Time from Unsealing to
Soldering
PACKAGE IS
OPENED LESS
THAN 72 HOURS
After removal from the bag, the
parts should be soldered within
three days if stored at the recom-
mended storage conditions.
NO BAKING
IS NECESSARY
YES
NO
PERFORM RECOMMENDED
BAKING CONDITIONS
NO
Figure 16. Baking conditions chart.
11
LITEON [ LITE-ON TECHNOLOGY CORPORATION ]
