Moisture Proof Packaging
The HDSL-3201 is shipped in moisture
proof packaging. Once opened,
moisture absorption begins.
Recommended Land Pattern for HSDL-3201#021
(Front Options)
C
L
SHIELD
1.35
MOUNTING
CENTER
SOLDER PAD
This part is compliant to JEDEC Level
4.
3.
1.25
2.05
Recommended Storage
Conditions
0.10
Storage
Temperature
10°C to 30°C
0.775
Relative
below 60% RH
1.75
Humidity
FIDUCIAL
Time from Unsealing to
Soldering
0.60
0.475
After removal from the bag, the parts
1.425
UNIT: mm
2.375
should be soldered within three days
7
3.325
if stored at the recommended storage
conditions.
Baking
If the parts are not stored in dry
conditions, they must be baked
before reflow to prevent damage to
the parts.
Recommended Land Pattern for HSDL-3201#008
(Top Options)
Package Temp.
Time
In reels
60°C
100°C
125°C
150°C
≥ 48 hours
≥ 4 hours
≥ 2 hours
≥ 1 hour
2.20
1.45
In bulk
0.9
MOUNTING CENTER
1.275
Baking should only be done once.
0.575
1.60
0.60
PITCH 7 x 0.95
3.625
11
LITEON [ LITE-ON TECHNOLOGY CORPORATION ]
