LTC3526-2/LTC3526B-2
PACKAGE DESCRIPTION
DC Package
6-Lead Plastic DFN (2mm × 2mm)
(Reference LTC DWG # 05-08-1703)
R = 0.115
TYP
0.56 0.05
(2 SIDES)
0.38 0.05
4
6
0.675 0.05
2.50 0.05
1.15 0.05
0.61 0.05
(2 SIDES)
2.00 0.10
(4 SIDES)
PIN 1 BAR
TOP MARK
(SEE NOTE 6)
PIN 1
PACKAGE
OUTLINE
CHAMFER OF
EXPOSED PAD
(DC6) DFN 1103
3
1
0.25 0.05
0.25 0.05
0.50 BSC
0.50 BSC
0.75 0.05
0.200 REF
1.37 0.05
(2 SIDES)
1.42 0.05
(2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
0.00 – 0.05
BOTTOM VIEW—EXPOSED PAD
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WCCD-2)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
35262b2fa
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
15
Linear [ Linear ]
