LT1521/LT1521-3
LT1521-3.3/LT1521-5
U
W U U
APPLICATIONS INFORMATION
Table 4. Fault Conditions
INPUT PIN
SHDN PIN
OUTPUT/SENSE PINS
RESULTING CONDITIONS
< V
(Nominal)
Open (High)
Forced to V
(Nominal)
Reverse Output Current ≈ 5µA (See Figure 3)
Input Current ≈ 1µA (See Figure 4)
OUT
OUT
OUT
< V
(Nominal)
Grounded
Forced to V
(Nominal)
Reverse Output Current ≈ 5µA (See Figure 3)
Input Current ≈ 1µA (See Figure 4)
OUT
Open
Open (High)
Grounded
> 1V
> 1V
≤ 0V
≤ 0V
≤ 0V
≤ 0V
Reverse Output Current ≈ 5µA (See Figure 3)
Reverse Output Current ≈ 5µA (See Figure 3)
Output Current = 0
Open
≤ 0.8V
≤ 0.8V
> 1.5V
Open (High)
Grounded
Output Current = 0
Open (High)
Grounded
Output Current = Short-Circuit Current
Output Current = 0
–20V < V < 20V
IN
U
PACKAGE DESCRIPTION
MS8 Package
8-Lead Plastic MSOP
(Reference LTC DWG # 05-08-1660)
0.889 ± 0.127
(.035 ± .005)
5.23
(.206)
MIN
3.2 – 3.45
(.126 – .136)
3.00 ± 0.102
(.118 ± .004)
0.52
0.65
(.0256)
BSC
0.42 ± 0.04
(.0165 ± .0015)
TYP
(.206)
REF
(NOTE 3)
8
7 6 5
RECOMMENDED SOLDER PAD LAYOUT
3.00 ± 0.102
(.118 ± .004)
NOTE 4
4.88 ± 0.1
(.192 ± .004)
DETAIL “A”
0.254
(.010)
0° – 6° TYP
GAUGE PLANE
1
2
3
4
0.53 ± 0.015
(.021 ± .006)
1.10
(.043)
MAX
0.86
(.034)
REF
DETAIL “A”
0.18
(.077)
SEATING
PLANE
0.22 – 0.38
(.009 – .015)
0.13 ± 0.05
(.005 ± .002)
0.65
(.0256)
BCS
MSOP (MS8) 1001
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
1521335fb
13
Linear [ Linear ]
