LT1129/LT1129-3.3/LT1129-5
APPLICATIONS INFORMATION
Table 4. Fault Conditions
INPUT PIN
SHDN PIN
OUTPUT PIN
< V
< V
(Nominal)
Open (Hi)
Forced to V
(Nominal)
Reverse Output Current ≈ 15μA (See Figure 3)
Input Current ≈ 1μA (See Figure 4)
OUT
OUT
(Nominal)
Grounded
Forced to V
(Nominal)
Reverse Output Current ≈ 15μA (See Figure 3)
Input Current ≈ 1μA (See Figure 4)
OUT
OUT
Open
Open
Open (Hi)
Grounded
Forced to V
Forced to V
(Nominal)
(Nominal)
Reverse Output Current ≈ 15μA (See Figure 3)
Reverse Output Current ≈ 15μA (See Figure 3)
OUT
OUT
PACKAGE DESCRIPTION
F Package
20-Lead Plastic TSSOP (4.4mm)
(LTC DWG # 05-08-1650)
6.40 – 6.60*
(.252 – .260)
1.05 0.10
4.50 0.10
20 19 18 17 16 15 14 13 12 11
6.60 0.10
6.40
(.252)
BSC
0.45 0.05
RECOMMENDED SOLDER PAD LAYOUT
0.65 BSC
5
7
8
1
2
3
4
6
9 10
1.10
(.0433)
MAX
4.30 – 4.50**
(.169 – .177)
0.25
REF
0° – 8°
0.65
(.0256)
BSC
0.09 – 0.20
0.50 – 0.75
0.05 – 0.15
(.0035 – .0079)
(.020 – .030)
(.002 – .006)
0.19 – 0.30
(.0075 – .0118)
TYP
F20 TSSOP 0204
NOTE:
1. CONTROLLING DIMENSION: MILLIMETERS
MILLIMETERS
2. DIMENSIONS ARE IN
(INCHES)
3. DRAWING NOT TO SCALE
*DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED .152mm (.006") PER SIDE
OBSOLETE PACKAGE
112935ff
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
13
Linear [ Linear ]
