LT1124/LT1125
package DescripTion
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
N8 Package
8-Lead PDIP (Narrow .300 Inch)
(Reference LTC DWG # 05-08-1510 Rev I)
.400*
(10.160)
MAX
.130 ±.005
(3.302 ±0.127)
.300 – .325
(7.620 – 8.255)
.045 – .065
(1.143 – 1.651)
8
1
7
6
5
4
.065
(1.651)
TYP
.008 – .015
(0.203 – 0.381)
.255 ±.015*
(6.477 ±0.381)
.120
(3.048)
MIN
.020
(0.508)
MIN
+.035
–.015
.325
.018 ±.003
(0.457 ±0.076)
.100
(2.54)
BSC
+0.889
8.255
2
3
N8 REV I 0711
(
)
–0.381
NOTE:
INCHES
1. DIMENSIONS ARE
MILLIMETERS
*THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.
MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .010 INCH (0.254mm)
S8 Package
8-Lead Plastic Small Outline (Narrow .150 Inch)
(Reference LTC DWG # 05-08-1610 Rev G)
.189 – .197
(4.801 – 5.004)
.045 ±.005
NOTE 3
.050 BSC
7
5
8
6
.245
MIN
.160 ±.005
.150 – .157
(3.810 – 3.988)
NOTE 3
.228 – .244
(5.791 – 6.197)
.030 ±.005
TYP
1
3
4
2
RECOMMENDED SOLDER PAD LAYOUT
.010 – .020
(0.254 – 0.508)
× 45°
.053 – .069
(1.346 – 1.752)
.004 – .010
(0.101 – 0.254)
.008 – .010
(0.203 – 0.254)
0°– 8° TYP
.016 – .050
(0.406 – 1.270)
.050
(1.270)
BSC
.014 – .019
(0.355 – 0.483)
TYP
NOTE:
INCHES
1. DIMENSIONS IN
(MILLIMETERS)
2. DRAWING NOT TO SCALE
3. THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.
MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .006" (0.15mm)
4. PIN 1 CAN BE BEVEL EDGE OR A DIMPLE
SO8 REV G 0212
11245ff
15
For more information www.linear.com/LT1124