LT1117/LT1117-2.85
LT1117-3.3/LT1117-5
U
O
TYPICAL APPLICATI S
High Efficiency Regulator
LT1117
ADJ
1mH
OUTPUT
28V INPUT
IN
OUT
+
240Ω
MR1122 10,000µF
10k
+
470Ω
100µF
2k
OUTPUT
ADJUST
28V
1N914
1k
1M
4N28
10k
+
–
LT1011
10k
28V
1N914
LT1117 • TA15
U W
ETHODS
SOLDERI G
The SOT-223 is manufactured with gull wing leadform for
surface mount applications. The leads and heatsink are
solder plated and allow easy soldering using non-active or
mildly active fluxes. The package is constructed with three
leads exiting one side of the package and one heatsink
exiting the other side, and the die attached to the heatsink
internally.
The recommended methods of soldering SOT-223 are:
vapor phase reflow and infrared reflow with preheat of
component to within 65°C of the solder temperature.
Hand soldering and wave soldering are not recom-
mended since these methods can easily damage the
part with excessive thermal gradients across the pack-
age.
LT1117 • TA18
Care must be exercised during surface mount to minimize
large (> 30°C per second) thermal shock to the package.
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tationthattheinterconnectionofitscircuitsasdescribedhereinwillnotinfringeonexistingpatentrights.
11
Linear [ Linear ]
