LT1078/LT1079
U
Dimensions in inches (millimeters) unless otherwise noted.
PACKAGE DESCRIPTION
H Package
8-Lead TO-5 Metal Can (0.230 PCD)
(LTC DWG # 05-08-1321)
0.335 – 0.370
(8.509 – 9.398)
DIA
0.305 – 0.335
(7.747 – 8.509)
0.040
(1.016)
MAX
0.027 – 0.045
(0.686 – 1.143)
0.050
(1.270)
MAX
45°TYP
0.165 – 0.185
(4.191 – 4.699)
0.027 – 0.034
(0.686 – 0.864)
REFERENCE
PLANE
0.200
(5.080)
TYP
SEATING
PLANE
GAUGE
PLANE
0.500 – 0.750
(12.700 – 19.050)
0.010 – 0.045*
(0.254 – 1.143)
0.016 – 0.021**
(0.406 – 0.533)
0.110 – 0.160
(2.794 – 4.064)
INSULATING
STANDOFF
*LEAD DIAMETER IS UNCONTROLLED BETWEEN THE REFERENCE PLANE
AND 0.045" BELOW THE REFERENCE PLANE
0.016 – 0.024
**FOR SOLDER DIP LEAD FINISH, LEAD DIAMETER IS
(0.406 – 0.610)
H8(TO-5) 0.200 PCD 0595
J8 Package
8-Lead CERDIP (Narrow 0.300, Hermetic)
(LTC DWG # 05-08-1110)
0.200
(5.080)
MAX
0.405
(10.287)
MAX
CORNER LEADS OPTION
(4 PLCS)
0.300 BSC
(0.762 BSC)
0.005
(0.127)
MIN
0.015 – 0.060
(0.381 – 1.524)
6
5
4
8
7
0.023 – 0.045
(0.584 – 1.143)
HALF LEAD
OPTION
0.025
(0.635)
RAD TYP
0.220 – 0.310
(5.588 – 7.874)
0.045 – 0.068
0.008 – 0.018
(0.203 – 0.457)
0° – 15°
(1.143 – 1.727)
FULL LEAD
OPTION
0.045 – 0.068
(1.143 – 1.727)
0.125
3.175
MIN
1
2
3
0.385 ± 0.025
(9.779 ± 0.635)
0.100 ± 0.010
(2.540 ± 0.254)
0.014 – 0.026
(0.360 – 0.660)
J8 0694
NOTE: LEAD DIMENSIONS APPLY TO SOLDER DIP/PLATE OR TIN PLATE LEADS.
J Package
14-Lead CERDIP (Narrow 0.300, Hermetic)
(LTC DWG # 05-08-1110)
0.200
(5.080)
MAX
0.300 BSC
(0.762 BSC)
0.785
(19.939)
MAX
0.005
(0.127)
MIN
0.015 – 0.060
(0.381 – 1.524)
14
12
13
11
10
9
8
0.220 – 0.310
(5.588 – 7.874)
0.025
(0.635)
RAD TYP
0.008 – 0.018
(0.203 – 0.457)
0° – 15°
0.385 ± 0.025
(9.779 ± 0.635)
0.045 – 0.068
(1.143 – 1.727)
0.100 ± 0.010
(2.540 ± 0.254)
0.125
(3.175)
MIN
2
3
4
5
6
1
7
0.014 – 0.026
(0.360 – 0.660)
J14 0996
NOTE: LEAD DIMENSIONS APPLY TO SOLDER DIP OR TIN PLATE LEADS.
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tationthattheinterconnectionofitscircuitsasdescribedhereinwillnotinfringeonexistingpatentrights.
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