LT3498
PACKAGE DESCRIPTION
DDB Package
12-Lead Plastic DFN (3mm × 2mm)
(Reference LTC DWG # 05-08-1723 Rev Ø)
0.64 0.05
(2 SIDES)
0.70 0.05
2.55 0.05
1.15 0.05
PACKAGE
OUTLINE
0.25 0.05
0.45 BSC
2.39 0.05
(2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
R = 0.115
TYP
7
0.40 0.10
12
3.00 0.10
(2 SIDES)
R = 0.05
TYP
2.00 0.10
(2 SIDES)
PIN 1 BAR
TOP MARK
PIN 1
R = 0.20 OR
(SEE NOTE 6)
0.25 × 45°
0.64 0.10
(2 SIDES)
CHAMFER
6
1
(DDB12) DFN 0106 REV Ø
0.23 0.05
0.75 0.05
0.200 REF
0.45 BSC
2.39 0.10
(2 SIDES)
0 – 0.05
BOTTOM VIEW—EXPOSED PAD
NOTE:
1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE
3498f
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
23
Linear [ Linear ]
