LT119A/LT319A
LM119/LM319
U
PACKAGE DESCRIPTION
Dimension in inches (millimeters) unless otherwise noted.
H Package
10-Lead T0-5 Metal Can
0.016 – 0.021
(0.406 – 0.533)
0.335 – 0.370
(8.509 – 9.398)
DIA
36°BSC
0.305 – 0.335
(7.747 – 8.509)
0.040
(1.016)
MAX
0.027 – 0.045
(0.686 – 1.143)
0.027 – 0.034
(0.686 – 0.864)
0.050
(1.270)
MAX
0.165 – 0.185
(4.191 – 4.699)
0.230
( 5.842)
REFERENCE
PLANE
BSC
SEATING
PLANE
GAUGE
PLANE
0.500 – 0.750
(12.700 – 19.050)
0.010 – 0.045
(0.254 – 1.143)
0.110 – 0.160
(2.794 – 4.064)
INSULATING
STANDOFF
H10(5) 0592
NOTE: LEAD DIAMETER IS UNCONTROLLED BETWEEN
THE REFERENCE PLANE AND SEATING PLANE.
J Package
14-Lead Ceramic DIP
0.785
(19.939)
CORNER LEADS OPTION
(4 PLCS)
0.005
(0.127)
MIN
MAX
14
13
12
11
10
9
8
0.023 – 0.045
(0.584 – 1.143)
HALF LEAD
OPTION
0.220 – 0.310
(5.588 – 7.874)
0.025
(0.635)
RAD TYP
0.045 – 0.068
(1.143 – 1.727)
FULL LEAD
OPTION
2
3
4
5
6
1
7
0.200
(5.080)
MAX
0.300 BSC
(0.762 BSC)
0.015 – 0.060
(0.381 – 1.524)
0.008 – 0.018
(0.203 – 0.457)
0° – 15°
0.385 ± 0.025
(9.779 ± 0.635)
0.045 – 0.068
(1.143 – 1.727)
0.100 ± 0.010
(2.540 ± 0.254)
0.125
(3.175)
MIN
0.014 – 0.026
(0.360 – 0.660)
J14 0594
NOTE: LEAD DIMENSIONS APPLY TO SOLDER DIP OR TIN PLATE LEADS.
N Package
14-Lead Plastic DIP
0.770*
(19.558)
MAX
0.300 – 0.325
(7.620 – 8.255)
0.045 – 0.065
(1.143 – 1.651)
0.130 ± 0.005
(3.302 ± 0.127)
14
13
12
11
10
9
8
7
0.015
(0.380)
MIN
0.260 ± 0.010*
(6.604 ± 0.254)
0.065
(1.651)
TYP
0.009 – 0.015
(0.229 – 0.381)
+0.025
1
2
3
5
6
4
0.325
–0.015
0.125
(3.175)
MIN
0.075 ± 0.015
(1.905 ± 0.381)
0.018 ± 0.003
(0.457 ± 0.076)
+0.635
8.255
(
)
–0.381
0.100 ± 0.010
(2.540 ± 0.254)
N14 0594
*THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.
MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.010 INCH (0.254mm).
LT/GP 0694 5K REV A • PRINTED IN USA
LINEAR TECHNOLOGY CORPORATION 1994
Linear Technology Corporation
1630 McCarthy Blvd., Milpitas, CA 95035-7487
8
●
●
(408) 432-1900 FAX: (408) 434-0507 TELEX: 499-3977
Linear [ Linear ]
