Plastic Package Facts:
Plating Material: Plastic Packages- Matte 100% Tin
Material of Lead Frame: Copper 194, or Alloy 42
Lead Content of the Plating Material: Lead Free (Less than 0.1%, 1000ppm
by weight)
Soldering: Maximum Temperature=260 Degree C, Maximum Time=20-40
seconds
Reflow Profile: Peak Temperature=260 Degree C, Peak Time=20-40
seconds
Acceptable number of Reflows: 3 times
Backward Compatibility: Lead Free packages can be soldered using
existing Sn-Pb solder and temperature profiles
Forward Compatibility: Lead Free Packages can be soldered using lead free
solders and the appropriate higher temperature profiles
Storage Conditions: Jedec Std. 20, Level 1
Questions:
Q1:
When does LIS plan to offer Lead Free packaging to its customers?
A1:
LIS has begun offering customers Lead Free packaging for plastic packages
as of 1/1/04, per customer request.
Q2:
When does LIS plan to offer RoHS compliant packaging to its customers?
A2:
LIS has begun offering customers RoHS compliant packaging for it plastic
packages as of 1/1/05, per customer request.
Q3:
Will LIS continue to offer Non-Lead Free (contains lead) packaging to its
customers?
A3:
Yes, LIS will continue to offer Non-Lead Free packaging, per customer
request.
Q4:
How do I order Lead Free parts versus Non-Lead Free Parts?
A4:
When ordering, specify "Lead-Free" in your part description on Purchase
Orders and Quotations.
Q5:
How do I order RoHS Compliant Parts versus Non-RoHS Compliant Parts?
A5:
When ordering, specify "RoHS Compliant" in your part description on
Purchase Orders and Quotations.
Q6:
How will I be able to identify a Lead-Free / RoHS Compliant Part versus a
Non-Lead Free Part / Non RoHS Compliant Part?
A6:
The Lead-Free RoHS Compliant Part will be marked with the letter "F".
Q7:
Are there any additional costs for ordering Lead-Free or RoHS Compliant
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